Dynamic behavior of VFBGA solder joints under drop impact

Xiao-yan Niu, Ying-jie Yu and

Abstract

Based on the JEDEC standards, the three-dimensional finite element model of the board level VFBGA package was established, and the reliability of the lead-free solder under dropping impact was observed. An impact life prediction model, which is formulated according to the power law, and the maximum peeling stress of the critical solder joint is proposed for the drop test of the board level to estimate the number of drops to failure. The average impact life for two lead-free solders Sn3.0Ag0.5Cu and Sn3.5Ag is 132.84 and 59.02 respectively, with Sn3.0Ag0.5Cu in the drop test demonstrating a better ability to resist the deformation.